With the further deepening of COBIP technology practice activities, the development of new LED display technologies and products is more inclined towards high integration, mainly reflected in design integration, manufacturing integration, industry integration, and cross industry integration. In the General-purpose technology Specification for Mini LED Commercial Display Screen, we have seen that the packaging technology in the LED display field has been reclassified and defined again. The packaging technology is divided into two categories: “System in a package technology for stand alone devices” and “de stand integrated System in a package technology”. I always think this is a big event with epochal significance. The COCIP and CNCIP technologies belong to the second generation of the off rack integrated System in a package technology. Compared with the first generation of the “semi off rack pin” COBIP technology under the System in a package technology, the “fully off rack pin” integrated packaging of LED display panels has been realized. Simply put, it means that the light drive is integrated and packaged with the same pixel layout. COCIP (Chip On Chip Integrated Packaging) technology is an integrated packaging of dual function bare crystal level chips with the same pixel vertical stacking layout, while CNCIP (Chip Next to Chip Integrated Packaging) technology is an integrated packaging of dual function bare crystal level chips with the same pixel plane layout.

The breakthrough of this new technology has not been seen in the industry’s high-profile small pitch display and micro pitch display products, and it is fully in line with the research and development logic. Just like the COBIP technology that first appeared in the industry in 2010, it gradually transitioned from single and dual color display applications to full color display applications, and only entered small pitch display and micro pitch display application products 6 years later. Someone told me, “Actually, before you started COB, the Japanese and Koreans were already working on COB technology I have no doubt about this point, but their attitude towards COB packaging is the same as that of most packaging manufacturers in our country. After failure, they hold a negative attitude and did not continue to persist. However, the COBIP technology we studied in 2010 has unique technical characteristics since its inception, which is the first one board light drive integrated panel integration technology in the industry. The pixel integration of COB integrated packaging panels started at 0 5K, the pixel surfaces of the lamp beads have all removed the brackets and pins used in traditional packaging technology. In 2016, we began giving lectures on COBIP outdoor small pitch technology in the Netherlands and the United States. The low dead light rate of COBIP products woke up Japanese people, and due to its strong industrial manufacturing foundation, we quickly produced impressive COBIP small pitch products. The reason why they dare to enter the Chinese market after 2020 is because the patent for this technology is not in their hands. Similarly, CNCIP technology also needs to first break through from the market of large-distance applications with more commercial value. In addition, COCIP and CNCIP will provide higher quality technical solutions for backlight panel products and lighting applications in the LCD display field