SMD is the abbreviation for Surface Mounted Device, which encapsulates materials such as lamp cups, brackets, chips, leads, and epoxy resin into different specifications of lamp beads, and then forms LED display modules by soldering them onto a PCB board in the form of patches.

SMD displays generally require the LED beads to be exposed, which not only easily causes cross talk between pixels, but also results in poor protective performance, affecting imaging performance and service life.

Schematic diagram of SMD microstructure

COB, abbreviated as Chip On Board, refers to the LED packaging technology that directly solidifies LED chips onto printed circuit boards (PCBs), rather than soldering individual shaped LED packages onto PCBs.

This packaging method has certain advantages in production and manufacturing efficiency, imaging quality, protection, and small micro spacing applications.